ELIGIBILITY:

Available to domestic and international students.

Available to those applying for undergraduate or postgraduate study who have not yet commenced at Bond University. 

To be eligible to apply for this scholarship, you must:

Have strong leadership skills, community involvement and demonstrated potential to affect change.

Have had extensive involvement in extracurricular activities; and

Meet the entry requirements for your chosen program of study and commence in the following January semester.

If you meet the eligibility criteria for this scholarship, we encourage you to apply by following the below steps:

Complete the Bond University Study Application Form to lodge your application for your chosen program. Learn more about this process.

Complete the Bond University Scholarship Application Form. Simply use the same log-in details as used for your study application and enter ‘scholarship’ in the keyword field on the ‘Start an Application’ tab.  

You must complete and submit your scholarship application before the application closing date, as no late scholarship applications will be considered!

Applications for 2027 entry open on Friday, 1 May, 2026 and close on Friday, 31 August, 2026.

Please note, if you are applying for scholarships with different closing dates, you must submit your full scholarship application by the earliest closing date. 

BENEFIT:

Provides 50% tuition remission for any undergraduate degree, including approved combined programs up to 320 credit points (excluding the Bond Medical Program), or postgraduate degree (excluding research degrees).